infosecdj:cypress:cy62127dv30ll
1Mbit SRAM chip.
Reportedly, 2-metal-layer 130nm process at FAB4.
Package
CY62127DV3 0LL-55BVXI PHI 1513 D 04 CYP 638255
Die
(Logo) (C) 2002 (M) Cypress 7C62125D
Top metal imaged using Nikon Plan Apo 40x/1.0 oil
- Single (33443×27922, 187.54MiB)
infosecdj/cypress/cy62127dv30ll.txt · Last modified: 2025/09/25 19:59 by infosecdj