Differences

This shows you the differences between two versions of the page.

--- decap:ceramic_metal [2012/12/12 07:09] – created mcmaster
+++ decap:ceramic_metal [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 2: / Line 2: @@
 The [[metal]] page has some general tips.
 ===== Cutting =====
@@ Line 18: / Line 19: @@
-====== Die ======
+====== Die attach / removal ======
-Sometimes dies are soldered to a substrate (eg: silver heatsink / carrier).  Example after die was removed (by force):
+Attachment methods include:
+  * Glass
+  * Metal (usually silver) epoxies
+  * Solders
+Generally removing dies from ceramic packages has proven difficult, especially when affixed with glass.  So the general advice is don't remove the die form the package unless you have to.  For general imaging there should be no reason to remove it from the package and the die should be better protected too.
+====== Solder ======
+Example soldered die after removed by force:
 {{:decap:metal:silver_solder:corner.jpg?300|}}
@@ Line 29: / Line 40: @@
 Of course, it might take a while to get under the entire die.  Heating without will help to get it off but I have found that it can take a lot of force to move even with solder melted and so its best to chemically remove as much silver as possible first.
+====== Glass ======
+{{:decap:ceramic:diamond_wheel.jpg?300|}}
+Surface tension sometimes makes it difficult to remove dies.  Cutting a side of the package off so it can slide out can be much easier.  However, ceramic is difficult to cut.  Even a diamond bit will be slow to cut, don't bother with others.  Only use for very valuable specimens that you are willing to spend the time to carefully remove.