carrier:smt
Differences
This shows you the differences between two versions of the page.
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| carrier:smt [2012/06/22 05:41] – created mcmaster | carrier:smt [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
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| * MELF: Metal Electrode Leadless Face (usually for resistors and diodes) | * MELF: Metal Electrode Leadless Face (usually for resistors and diodes) | ||
| * SOD: Small Outline Diode. | * SOD: Small Outline Diode. | ||
| + | * Tape automated bonding (TAB): technique used to feed chips in to a pick n' place | ||
| + | {{: | ||
| + | {{: | ||
| + | |||
| Chip carrier: | Chip carrier: | ||
carrier/smt.1340343681.txt.gz · Last modified: 2013/10/20 14:59 (external edit)