, , , ,

Reportedly fabbed using a 2-metal-layer, 350nm process at GSMC.

Package

CY8C24533-
24PVXI 2307
A 05 CYP 605674
C

Die

(M) Cypress
(M) CMS
(Logo)
8C24033A
(C) 2007

siliconprawn.org_map_cypress_cy8c24533-24pvxi_single_cypress_cy8c24533-24pvxi_infosecdj_mz_nikpa40x.thumb.jpg

Top metal imaged using Nikon Plan Apo 40x/1.0 oil