, , , ,

1Mbit SRAM chip.

Reportedly, 2-metal-layer 130nm process at FAB4.

Package

CY62127DV3
0LL-55BVXI
PHI 1513
D 04
CYP 638255

Die

(Logo)
(C) 2002
(M) Cypress
7C62125D

siliconprawn.org_map_cypress_cy62127dv30ll_single_cypress_cy62127dv30ll_infosecdj_mz_nikpa40x.thumb.jpg

Top metal imaged using Nikon Plan Apo 40x/1.0 oil