, , , ,

Reportedly 2-metal-layer, 350nm process at FAB4.

Package

CY2213ZXC
-1
1719 A 04
622447

Die

(Logo)
(M) Cypress
(C) 2000
7C80810A

siliconprawn.org_map_cypress_cy2213zxc_single_cypress_cy2213zxc_infosecdj_mz_nikpa40x.thumb.jpg

mz_nikpa40x