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mcmaster:start [2021/01/29 19:28] – mcmastermcmaster:start [2025/08/04 21:23] (current) – external edit 127.0.0.1
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 Images: Images:
-{{topic>collection_jm}} 
  
 {{topic>collection_mcmaster}} {{topic>collection_mcmaster}}
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 Relevant equipment list: Relevant equipment list:
-  * pr0nscope: CNC microscope.  Typically BF imaging, but also have DF, polarized, DIC+  * prawnscope: CNC microscope.  Typically BF imaging, but also have DF, polarized, DIC
   * k2scope: K2 IND CNC confocal microscope   * k2scope: K2 IND CNC confocal microscope
   * brainscope: laser microscope / probe station.  532 nm, 355 nm Nd:YAG   * brainscope: laser microscope / probe station.  532 nm, 355 nm Nd:YAG
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     * Decapping involves harsh chemicals, direct expenses, high NRE, and time so contributions are greatly appreciated     * Decapping involves harsh chemicals, direct expenses, high NRE, and time so contributions are greatly appreciated
   * Any potential legal issues associated with the chip?   * Any potential legal issues associated with the chip?
-    * Ex: DRM, crypto+    * If so, it will be evaluated on a case by case basis 
 +    * Ex: DRM, crypto can be problematic
     * Ex: a typical sound chip or microcontroller is not an issue     * Ex: a typical sound chip or microcontroller is not an issue
 +    * I will not work on: satellite, cable TV
   * Clearly identify the chips, especially if you are sending more than one   * Clearly identify the chips, especially if you are sending more than one
     * Ex: specify "344S0061-A" instead of"SWIM", since that's what's printed on it     * Ex: specify "344S0061-A" instead of"SWIM", since that's what's printed on it
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   * Do you have a particular timeline in mind?   * Do you have a particular timeline in mind?
     * Coordinate with me for best results     * Coordinate with me for best results
-  * By default I retain copyright and publish work CC BY on siliconpr0n.org+  * By default I retain copyright and publish work CC BY on siliconprawn.org
  
 In short, I focus on chips that are of interest to me.  I do lots of chips for others, but I give priority to people that are able to provide funds. This section is written with open source projects as the main audience, but note I also offer services through my embedded security consulting service. In short, I focus on chips that are of interest to me.  I do lots of chips for others, but I give priority to people that are able to provide funds. This section is written with open source projects as the main audience, but note I also offer services through my embedded security consulting service.
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 Delayering is typically more risky to the chip and myself (toxic chemicals like hydrofluoric acid). Similar issues with staining and lapping.  Lapping is currently extremely labor intensive and not very well refined (although I can get a small area easily). Delayering is typically more risky to the chip and myself (toxic chemicals like hydrofluoric acid). Similar issues with staining and lapping.  Lapping is currently extremely labor intensive and not very well refined (although I can get a small area easily).
  
-I prefer to focus on chips that I can (eventually) release on siliconpr0n.org, ideally under CC licenses.+I prefer to focus on chips that I can (eventually) release on siliconprawn.org, ideally under CC licenses.
  
 In general I want to focus on R&D / labwork and not hand digitization.  I do have some limited semi-automatic digitization capabilities for planarized chips though that I'd like to develop (ex: works on PS1 chipset). In general I want to focus on R&D / labwork and not hand digitization.  I do have some limited semi-automatic digitization capabilities for planarized chips though that I'd like to develop (ex: works on PS1 chipset).
  
-Most of this is targeted towards small chips up to the mid 90's.  If the die is obnoxiously large (ex: 486 CPU) it will be difficult for me to photograph and stitch the entire thing.  Similarly most of my equipment is targeted towards larger processes (say 180+nm), although I do have a small SEM if required. See [[https://siliconpr0n.org/map/xilinx/xc2c32a/lap4-04_mit20x/|XC2C32A]] for an example 180 nm chip taken with a relatively low power objective, noting in theory I can get about 11x the detail (NA 0.42 => 1.4).+Most of this is targeted towards small chips up to the mid 90's.  If the die is obnoxiously large (ex: 486 CPU) it will be difficult for me to photograph and stitch the entire thing.  Similarly most of my equipment is targeted towards larger processes (say 180+nm), although I do have a small SEM if required. See [[https://siliconprawn.org/map/xilinx/xc2c32a/mcmaster_lap4-04_mit20x/|XC2C32A]] for an example 180 nm chip taken with a relatively low power objective, noting in theory I can get about 11x the detail (NA 0.42 => 1.4).
  
 Other: most of the work is in decapping, not actual imaging. If you happen to already have a bare, clean die and would be satisfied with a quick / lower quality scan, feel free to send me a few dies. This also can work out well since most of the NRE cost is in the microscope, not the decapping supplies. Other: most of the work is in decapping, not actual imaging. If you happen to already have a bare, clean die and would be satisfied with a quick / lower quality scan, feel free to send me a few dies. This also can work out well since most of the NRE cost is in the microscope, not the decapping supplies.
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 Chips are non-returnable. If you need something back, please make an explicit agreement before sending. Chips are non-returnable. If you need something back, please make an explicit agreement before sending.
  
 +
 +====== Scales ======
 +
 +mit20x vs mit20x2:
 +  * mit20x: BH2 microscope, MU800 camera, 0.5x relay lens, Mitutoyo M Plan Apo lens
 +  * mit20x2: BH2 microscope, USB3 camera, 0.75x relay lens?, Mitutoyo M Plan Apo lens
 +    * Select medium resolution 2736 x 1824
 +    * 20x
 +      * 0.42 @ 800 nm => 952 nm R objective resolution
 +      * 0.42 @ 532 nm => 633 nm G objective resolution
 +      * 0.42 @ 400 nm => 476 nm B objective resolution
 +      * About 820 um wide field of view
 +      * 820 / 2736 = 300 nm / pix raw
 +        * Cut image by half to sample RGB correctly => 600 nm / pix
 +      * 820 / 2736 / 0.5 = 599 nm / pix ultimate image resolution
 +    * vc60x => 1.4 NA
 +      * 1.4 @ 400 nm => 143 nm objective resolution
 +      * About 820 / (60/20) => 273 um FOV
 +      * 273 um / 2736 pix / 0.5 pix/pix => 200 nm / pix ultimate image resolution
 +    * Conclusion: possibly losing slight resolution in blue, but probably good enough
 +
 +TODO: link github calibration files
 +
 +^ Scope      ^ Objective  ^ NA  ^ Resolving power (nm)  ^ Camera  ^ nm / pix  ^ Notes               ^
 +| prawnscope  | mit2x      |     | 5000                  | MU800   | 3550      |                     |
 +| prawnscope  | mit5x      |     | 2000                  | MU800   | 1420      |                     |
 +| prawnscope  | mit10x     |     | 1000                  | MU800   | 710       |                     |
 +| prawnscope  | mit20x     |     | 700                   | MU800   | 355       |                     |
 +|            | mit20x2    |     |                       | 20MP    |           | New camera setup    |
 +| prawnscope  | ns50xu     |     |                       | MU800   | 142?      |                     |
 +| prawnscope  | nd50x      |     |                       | MU800   | 142?      |                     |
 +| prawnscope  | mit50xn    |     | 700                   | MU800   | 142       |                     |
 +| prawnscope  | mit100x    |     | 400                   | MU800   | 71        | FIXME: correct NA?  |
 +
 +
 +====== Die archive ======
 +
 +Chips that were decapped for imaging, but stalled out for one reason or another
 +
 +Includes
 +  * Konami 054539
 +    * Embargoed image data to be released 2022-12-13
 +  * Konami 053246
 +  * Konami 053247
  
 ====== References ====== ====== References ======
mcmaster/start.1611948522.txt.gz · Last modified: 2021/01/29 19:28 by mcmaster