Differences

This shows you the differences between two versions of the page.

--- infosecdj:winbond:we9110 [2025/08/28 11:19] – created - external edit 127.0.0.1
+++ infosecdj:winbond:we9110 [2025/08/28 11:26] (current) – infosecdj
@@ Line 1: / Line 1: @@
 {{tag>collection_infosecdj vendor_winbond type_unknown year_unknown foundry_unknown}}
+Apparently a DTMF dialer chip. No datasheet around.
 ====== Package ======
@@ Line 7: / Line 8: @@
 <code>
+(Logo)
+WE9110
 </code>
-{{:infosecdj:winbond:we9110:pack_btm.jpg?300|}}
+====== Die ======
 <code>
+TC5390
 </code>
-====== Die ======
 <code>
+TW5390
 </code>
 {{https://siliconprawn.org/map/winbond/we9110/single/winbond_we9110_infosecdj_mz_nikpa20x.thumb.jpg}}
-[[https://siliconprawn.org/map/winbond/we9110/infosecdj_mz_nikpa20x/|mz_nikpa20x]]
+[[https://siliconprawn.org/map/winbond/we9110/infosecdj_mz_nikpa20x/|Top metal imaged under Nikon Plan Apo 20x/0.75]]
   * [[https://siliconprawn.org/map/winbond/we9110/single/winbond_we9110_infosecdj_mz_nikpa20x.jpg|Single]] (19003x24751, 105.291MiB)