azonenberg:winbond:w25q80bv

Table of Contents

Package
Die
Map

collection az, vendor winbond, year 2008, type memory, type memory/flash, type memory/flash/nor, foundry unknown, tech unknown

1MB SPI flash

Package

Die

Die size is approximately 1590 x 1920 μm (3.0 mm²)

Map

http://siliconprawn.org/map/winbond/w25q80bv/mz_bf_neo10x/

azonenberg/winbond/w25q80bv.txt · Last modified: 2025/08/04 21:24 by 127.0.0.1