azonenberg:siliconimage:sii1364

Table of Contents

Board
Package
Die

collection az, year 2004, vendor siliconimage, type processor, type processor/gpu, foundry unknown, tech unknown

Looks like same process as usb3250

Board

Package

Die

Size is approximately 2790 x 2860 μm (7.98 mm²).

azonenberg/siliconimage/sii1364.txt · Last modified: 2025/08/04 21:24 by 127.0.0.1