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infosecdj:ti:twl3025bz [2024/07/13 18:56] – infosecdjinfosecdj:ti:twl3025bz [2025/08/04 21:23] (current) – external edit 127.0.0.1
Line 28: Line 28:
 The die was covered with PI. The die was covered with PI.
  
-{{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}+{{https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}
  
-[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_lmplan50x_halfres/|Top metal imaged with LMplan 50x LWD]]+[[https://siliconprawn.org/map/ti/twl3025bz/infosecdj_mz_lmplan50x_halfres/|Top metal imaged with LMplan 50x LWD]]
  
-  * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.jpg|Single]] (28378x28402, 161.591MiB) +  * [[https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.jpg|Single]] (28378x28402, 161.591MiB) 
-{{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.thumb.jpg}}+{{https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.thumb.jpg}}
  
-[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|Top metal imaged with Carl Zeiss PlanApo 40x/1.0]]+[[https://siliconprawn.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|Top metal imaged with Carl Zeiss PlanApo 40x/1.0]]
  
-  * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.jpg|Single]] (45054x45341, 455.515MiB)+  * [[https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.jpg|Single]] (45054x45341, 455.515MiB)
  
infosecdj/ti/twl3025bz.1720896980.txt.gz · Last modified: 2024/07/13 18:56 by infosecdj