Differences

This shows you the differences between two versions of the page.

--- infosecdj:ti:twl3025bz [2024/07/13 18:50] – infosecdj
+++ infosecdj:ti:twl3025bz [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 26: / Line 26: @@
 </code>
-The die was covered with PI, which was stripped with hot sulfuric acid.
+The die was covered with PI.
-{{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}
+{{https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}
-[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_lmplan50x_halfres/|Top metal imaged with LMplan 50x LWD]]
+[[https://siliconprawn.org/map/ti/twl3025bz/infosecdj_mz_lmplan50x_halfres/|Top metal imaged with LMplan 50x LWD]]
-  * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.jpg|Single]] (28378x28402, 161.591MiB)
+  * [[https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.jpg|Single]] (28378x28402, 161.591MiB)
-{{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.thumb.jpg}}
+{{https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.thumb.jpg}}
-[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|Top metal imaged with Carl Zeiss PlanApo 40x/1.0]]
+[[https://siliconprawn.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|Top metal imaged with Carl Zeiss PlanApo 40x/1.0]]
-  * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.jpg|Single]] (45054x45341, 455.515MiB)
+  * [[https://siliconprawn.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.jpg|Single]] (45054x45341, 455.515MiB)