Differences

This shows you the differences between two versions of the page.

--- infosecdj:philips:pcb80c51bh [2025/06/16 17:54] – infosecdj
+++ infosecdj:philips:pcb80c51bh [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 19: / Line 19: @@
 ====== Die ======
+Die size: 3.3x3.4mm approx.
+Bonding pad opening: 84.8 um, square.
+Metal pitch: 4 um.
+Poly pitch: 2.86 um.
+Poly width: 1.3 um.
 <code>
@@ Line 33: / Line 43: @@
 </code>
-{{https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x.thumb.jpg}}
+{{https://siliconprawn.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x.thumb.jpg}}
+[[https://siliconprawn.org/map/philips/pcb80c51bh/infosecdj_mz_nikpa40x/|Top metal imaged under a Nikon Plan Apo 40x/1.0 oil]]
+  * [[https://siliconprawn.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x.jpg|Single]] (42745x43518, 443.734MiB)
+{{https://siliconprawn.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s1.thumb.jpg}}
+[[https://siliconprawn.org/map/philips/pcb80c51bh/infosecdj_mz_nikpa40x_s1/|ILD remains + poly imaged under a Nikon Plan Apo 40x/1.0 oil]]
+  * [[https://siliconprawn.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s1.jpg|Single]] (42773x43563, 351.664MiB)
+{{https://siliconprawn.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s2.thumb.jpg}}
-[[https://siliconpr0n.org/map/philips/pcb80c51bh/infosecdj_mz_nikpa40x/|Top metal imaged under a Nikon Plan Apo 40x/1.0 oil]]
+[[https://siliconprawn.org/map/philips/pcb80c51bh/infosecdj_mz_nikpa40x_s2/|Poly imaged under a Nikon Plan Apo 40x/1.0 oil]]
-  * [[https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x.jpg|Single]] (42745x43518, 443.734MiB)
+  * [[https://siliconprawn.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s2.jpg|Single]] (42351x43581, 287.697MiB)