infosecdj:mitsubishi:m30620mc
Differences
This shows you the differences between two versions of the page.
| Both sides previous revisionPrevious revision | |||
| infosecdj:mitsubishi:m30620mc [2023/11/17 16:01] – infosecdj | infosecdj:mitsubishi:m30620mc [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
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| Line 55: | Line 55: | ||
| == Sample 1 == | == Sample 1 == | ||
| - | {{https://siliconpr0n.org/ | + | {{https://siliconprawn.org/ |
| - | [[https://siliconpr0n.org/ | + | [[https://siliconprawn.org/ |
| - | * [[https://siliconpr0n.org/ | + | * [[https://siliconprawn.org/ |
| == Sample 2 == | == Sample 2 == | ||
| - | {{https://siliconpr0n.org/ | + | {{https://siliconprawn.org/ |
| - | [[https://siliconpr0n.org/ | + | [[https://siliconprawn.org/ |
| - | * [[https://siliconpr0n.org/ | + | * [[https://siliconprawn.org/ |
| Note fewer pins are bonded out on this die, which is how it fit into a package with lesser pin count. | Note fewer pins are bonded out on this die, which is how it fit into a package with lesser pin count. | ||
infosecdj/mitsubishi/m30620mc.1700236916.txt.gz · Last modified: 2023/11/17 16:01 by infosecdj